SECURITIES
AND EXCHANGE COMMISSION
Washington,
D.C. 20549
FORM
6-K
REPORT
OF FOREIGN PRIVATE ISSUER
PURSUANT
TO RULE 13a-16 or 15d-16 OF
THE
SECURITIES EXCHANGE ACT OF 1934
Report
on Form 6-K dated July 25, 2007
STMicroelectronics
N.V.
(Name
of
Registrant)
39,
Chemin du Champ-des-Filles
1228
Plan-les-Ouates, Geneva, Switzerland
(Address
of Principal Executive Offices)
Indicate
by check mark whether the registrant files or will file annual reports under
cover of Form 20-F or Form 40-F.
Form
20-F x Form
40-F
o
Indicate
by check mark if the registrant is submitting the Form 6-K in paper as permitted
by Regulation S-T Rule 101(b)(7):
Yes o No
x
Indicate
by check mark whether the registrant by furnishing the information contained
in
this form is also thereby furnishing the information to the Commission pursuant
to Rule 12g3-2(b) under the Securities Exchange Act of 1934.
Yes o No
x
If
“Yes”
is marked, indicate below the file number assigned to the registrant in
connection with
Rule
12g3-2(b): 82- __________
Enclosure:
A
press
release dated July 24, 2007 announcing a collaboration between
STMicroelectronics and IBM for the development of chip technology.
 |
 |
STMicroelectronics
and IBM to Collaborate
on
Chip Technology
Geneva,
Switzerland and Armonk, N.Y. - July
24, 2007:
STMicroelectronics (NYSE: STM) and IBM (NYSE: IBM) today announced that the
two
companies have signed an agreement to collaborate on the development of
next-generation process technology - the “recipe” that is used in semiconductor
development and manufacturing.
The
agreement includes 32-nanometer (nm) and 22nm complementary
metal-oxide-semiconductor (CMOS) process-technology development, design
enablement and advanced research adapted to the manufacturing of 300-millimeter
(mm) silicon wafers. In addition it includes both the core bulk CMOS technology
and value-added derivative System-on-Chip (SoC) technologies and positions
both
companies at the leading edge of technology development. The new agreement
between IBM and ST will also include collaboration on IP development and
platforms to speed the design of system-on-chip devices in these
technologies.
As
part
of the agreement, each company will establish a technical development team
at
the other company’s facility. For bulk CMOS development, ST will establish a
research and development team in IBM’s Semiconductor Research and Development
Center in East Fishkill and Albany, New York. At the same time, IBM will
establish a research and development team at ST’s 300mm wafer semiconductor
R&D and fabrication facility in Crolles, France, where the two companies
will jointly develop a variety of value-added derivative technologies, such
as
embedded memory and analog/RF. These technologies can be broadly applied
in
consumer and server markets and in wireless applications, such as cell phones
and global positioning devices.
STMicroelectronics
will join a partnership of semiconductor manufacturing, development and
technology companies who collaborate to address the design complexity and
advanced process development necessary for producing smaller, faster, more
cost
efficient semiconductors. Members in this six-company development network
-
known as the IBM CMOS technology alliance -
benefit
from early access to technology, the ability to drive technology definition,
the
combined research and development resources for problem solving and access
to a
common manufacturing base.
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Similarly,
IBM and ST will work together to expand the network at ST’s 300mm
wafer semiconductor fabrication facility in France to
include other members
of IBM’s CMOS technology alliance interested
in the development of value-added derivative SoC technologies.
By
participating in open ecosystems that share resources among its members,
companies in these technology alliances realize an increase in the speed
of
innovation and decrease in associated costs that result from pooling individual
research and development strength and intellectual property. As the alliances
expand, the benefits from the collaborative relationships increase exponentially
as more associates apply more resources to the challenge of designing and
manufacturing better semiconductors, faster and cheaper.
“ST
has
made the strategic decision to focus more of its research and development
resources on developing value-added derivatives that capitalize on our extensive
know-how in system-orientated technologies,” said Laurent
Bosson, executive vice-president, Front-end Technology and Manufacturing,
STMicroelectronics. “Given
IBM’s distinguished track record in the development of advanced semiconductor
technologies, we believe working with them will give both companies the right
level of expertise and technical solutions to address and conquer these
strategic challenges and ensure time to market of competitive
products.”
“The
addition of STMicroelectronics to the IBM technology alliance continues to
strengthen our ability to address the semiconductor industry’s technical and
economic challenges inherent in developing advanced technologies,” said John E.
Kelly III, senior vice president, IBM Research. “Our joint expertise and
cooperative efforts with ST will help enhance process development efforts
while
also delivering faster time to market and greater technology advantage to
our
clients.”
The
jointly developed processes will be ramped up into volume production at ST’s
300mm wafer semiconductor fabrication facility (Crolles, France), as well
as in
the Common Platform manufacturers’ 300mm facilities, which includes
IBM.
With
a
longer-term perspective, IBM, CEA-LETI (Grenoble, France), and ST plan to
work
on advanced topics for future technology nodes, building on the long history
of
successful collaboration between the CEA-LETI public research institute and
ST.
Financial
details relating to this deal were not disclosed.
About
STMicroelectronics
STMicroelectronics
is a global leader in developing and delivering semiconductor solutions across
the spectrum of microelectronics applications. An unrivalled combination
of
silicon and system expertise, manufacturing strength, Intellectual Property
(IP)
portfolio and strategic partners positions the Company at the forefront of
System-on-Chip (SoC) technology and its products play a key role in enabling
today’s convergence markets. The Company’s shares are traded on the New York
Stock
-3-
Exchange,
on Euronext Paris and on the Milan Stock Exchange. In 2006, the Company’s net
revenues were $9.85 billion and net earnings were $782 million. Further
information on ST can be found at www.st.com.
For
further information about IBM Microelectronics, visit http://www.ibm.com/chips/
For
more
information about IBM Research, visit http://www.ibm.com/research
PR
No.
C2546C
For
further information please contact:
IBM
Bruce
McConnel
914-766-4427
wmcconn@us.ibm.com
ST
Mike
Markowitz
+1
212
821 8959
Michael.markowitz@st.com
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SIGNATURES
Pursuant
to the requirements of the Securities Exchange Act of 1934, STMicroelectronics
N.V. has duly caused this report to be signed on its behalf by the undersigned,
thereunto duly authorized.
| STMicroelectronics N.V. | ||
| |
|
|
| Date: July 25, 2007 | By: | /s/ CARLO FERRO |
|
|
||
|
Name:
Carlo Ferro
Title:
Executive Vice President and Chief Financial
Officer
|
||
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